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1 small-outline package integrated circuit
Универсальный англо-русский словарь > small-outline package integrated circuit
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2 small-outline (package) integrated circuit (SOIC)
Макаров: ИС в корпусе типа SOУниверсальный англо-русский словарь > small-outline (package) integrated circuit (SOIC)
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3 small-outline integrated circuit
2) Высокочастотная электроника: интегральная схема в малогабаритном корпусеУниверсальный англо-русский словарь > small-outline integrated circuit
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4 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead package
- beam-lead integrated circuit package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic-and-metal package - ceramic pin-grid array package - chip package - command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt package
- deca-watt I-leads package
- double-prong package - FEB package
- flangeless package
- flange-sealed package
- flat package
- flat package G
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package - high-energy leadless package
- high thermal plastic-ball grid array package
- inserted package
- integrated-circuit package
- integrated program package - micro ball-grid array package
- microcircuit package
- microepoxy package - modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package - sensory package - single-chip package - single-prong package
- skinny dual in-line package
- small outline package
- small outline J-leaded package
- small outline large package
- small outline transistor package
- small vertical package
- socket mounted package
- software package
- software compression-decompression package
- standard package
- standard inserted package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package - surface vertical package
- tape carrier package
- telemetering package - top-brazed package
- transistor-outline package -
5 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)5) набор; комплект (напр. оборудования) || изготавливать или поставлять в виде набора или комплекта6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead integrated circuit package
- beam-lead package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic dual in-line package
- ceramic pin-grid array package
- ceramic quad flat package
- ceramic-and-metal package
- ceramic-glass-metal package
- chaff package
- chip package
- chip scale package
- coaxial package
- command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt I-leads package
- deca-watt package
- double-prong package
- dual flat package with flat leads
- dual flat package
- dual in-line package
- FEB package
- flangeless package
- flange-sealed package
- flat package G
- flat package
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package
- heat-sink dual in-line package
- heat-sink quad flat package
- heat-sink single in-line package
- heat-sink small outline package
- heat-sink zigzag in-line package
- hermetic package
- high thermal plastic-ball grid array package
- high-energy leadless package
- inserted package
- integrated program package
- integrated-circuit package
- low-profile quad flat package
- metal electrode face bonded package
- micro ball-grid array package
- micro small outline package
- microcircuit package
- microepoxy package
- microwave package
- modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package
- plastic dual in-line package
- plastic quad flat package
- plastic small outline package
- plug-in package
- power flat package
- program package
- quad flat package with flat leads
- quad flat package with J-leads
- quad flat package
- quad in-line package
- radar package
- rectangular single in-line package
- self-contained package
- sensory package
- shrink dual in-line package
- shrink inserted package
- shrink single in-line package
- shrink small outline large package
- shrink small outline package
- shrink zigzag in-line package
- side-brazed package
- single edge processor package
- single in-line package
- single-chip package
- single-prong package
- skinny dual in-line package
- small outline J-leaded package
- small outline large package
- small outline package
- small outline transistor package
- small vertical package
- socket mounted package
- software compression-decompression package
- software package
- standard inserted package
- standard package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package
- surface horizontal package
- surface mount device package
- surface mount discrete package
- surface mounted package
- surface vertical package
- tape carrier package
- telemetering package
- thin quad flat package
- thin shrink outline L-leaded package
- thin small outline package I
- thin small outline package II
- thin small outline package
- TO package
- top-brazed package
- transistor-outline package
- ultra thin profile quad flat package
- ultra thin quad flat package
- very shrink pitch quad flat package
- windowed dual in-line package
- windowed small outline package
- zigzag in-line packageThe New English-Russian Dictionary of Radio-electronics > package
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6 package
2) тара3) упаковывание || упаковывать4) пачка; пакет6) набор; комплект7) набивка; уплотнение8) исполнение, вариант ( изготовления автомобиля)10) корпус || помещать в корпус; монтировать в корпусе11) вчт. пакет программ12) текст., швейн. паковка13) полигр. декель•-
accounting package
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aerosol package
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airborne guidance package
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airproof package
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anger package
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antifreeze package
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application package
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aseptic package
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beam-lead package
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benchmark package
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biodegradable package
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blade package
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blister package
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breathing package
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bucket teeth package
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canvas straps sustension package
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ceramic dual in-line package
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ceramic package
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chaff package
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chip package
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chip-carrier package
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CNC rebuild package
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coaxial package
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competent CNC package
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component package
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consumer package
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control package
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core lower package
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core upper package
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cutting edge package
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debug package
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design package
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development package
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DIL package
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disposable package
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distributed intelligence interactive drafting package
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distributed drafting package
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drafting package
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drive engineering package
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dual-in-line package
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dyeing package
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electronic control package
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engine powered package
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filter-regulator-lubricator package
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fleatlag package
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gasket package
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glass package
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graphics software package
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graphics package
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gravel package
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guidance package
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hardware and software package
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hybrid package
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immediate package
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individual package
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integrated package
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integrated-circuit package
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interior package
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large-sized package
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large-size package
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leadless package
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loose package
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low-profile package
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memory package
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molded package
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multichip package
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multiple package
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multiple-in-line package
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multiway package
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NC-IM package
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net package
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one-snot package
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palletized package
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pill package
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pin-grid array package
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pin-grid package
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plug-in package
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primary package
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production package
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production testing equipment package
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program package
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quadruple-in-line package
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quad-in-line package
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radar package
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retrofit package
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returnable package
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secondary package
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shrink package
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single in-line package
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skin package
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small-outline package
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small-outline transistor package
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SO package
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software package
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SOT package
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spent full package
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spray package
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spring suspension package
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stretch package
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stripline package
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supply package
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system package
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TAB package
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tailor-made package
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take-up package
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tape automated bonding package
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tape suspension package
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telemetering package
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tension spring package
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testing and debugging package
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thermoformed plastic package
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throw-away package
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tintsoft package
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TO package
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tropical package
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unit package
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vacuum-formed package -
7 SOIC
small-outline package integrated circuit - интегральная схема в корпусе типа SO; ИС в малогабаритном корпусе транзисторного типа; малогабаритная ИС; малогабаритный корпус ИС -
8 SOIC
1) Военный термин: Senior Official of the Intelligence Community, Space Operational Intelligence Center, Special Operations Intelligence Center, supply officer-in-command2) Техника: small-outline package integrated circuit3) Сокращение: Space Operational Intelligence Center (USA), Small Outline Integrated Circuit4) Макаров: small-outline ( package) integrated circuit -
9 SOIC
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10 SOIC
сокр. от small-outline (package) integrated circuit
См. также в других словарях:
small-outline package integrated circuit — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
Thin small-outline package — Thin small outline packages, or TSOPs are a type of surface mount IC package. They are notably very low profile (about 1mm) and have tight lead spacing (as low as 0.5mm).They are frequently used for RAM or Flash memory ICs dues to their high pin… … Wikipedia
low-profile integrated circuit — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Small-outline integrated circuit — A small outline integrated circuit (SOIC) is a surface mounted integrated circuit (IC) package which occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. They are generally available in the same… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
circuit intégré en boîtier de petites dimensions — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
circuit intégré en petit boîtier — mažakorpusis integrinis grandynas statusas T sritis radioelektronika atitikmenys: angl. low profile integrated circuit; small outline package integrated circuit vok. integrierter Schaltkreis im SO Gehäuse, n rus. интегральная схема в… … Radioelektronikos terminų žodynas
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Quad Flat Package — 44 poliges QFP (ein Mikroprozessor Z80) Quad Flat Package (QFP) bezeichnet in der Elektronik eine weit verbreitete Gehäusebauform für Integrierte Schaltungen. Die Anschlüsse (Pins) befinden sich an den vier Seiten des flachen Gehäuses. QFP werden … Deutsch Wikipedia
electronic substrate and package ceramics — Introduction advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components. Modern electronics are based on the integrated circuit, an assembly of millions of… … Universalium
